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Signal Integrity Issues

Signal integrity refers to the quality of a signal on a line. Signal integrity problems manifests themselves in many different ways. Ignoring them can cause logic or timing problems leading to compromised performance or even component failures. With over 10 years of signal integrity experience, Ludvik Kindl can provide effective solutions to your signal integrity issues.

 

Signal Integrity Issues
Attenuation Attenuation is a reduction of signal amplitude during transmission. At high frequencies, attenuation is a problem even when a signal travels just a few inches along a transmission line.
Capacitance Almost anything conductive (e.g., transmission lines, vias, connectors, IC package’ pins, input into receivers, stubs) has capacitance. Drivers must be capable of charging the capacitance fast enough to preserve the edge speed of signals.
Crosstalk Crosstalk is unwanted energy coming from adjacent aggressor traces into a victim trace under question.
Dielectric loss At high frequency, dielectric loss dominates and becomes a major contributor to the increase in rise and fall time of a signal’s edge.
Dispersion Since different frequency components of digital waveform propagate with varying speeds, a signal will be smeared in time. This is typically not a major issue.
EMI/EMC Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues need to be addressed early to prevent emission and reception of unwanted electromagnetic energy.
Ground bounce Ground bounce results when a current surge occurs in a circuit with an inductive ground connection.
Ground distribution In order to achieve good ground distribution, ground needs to be a continuous plane and provide a low impedance path to return currents.
Impedance discontinuities Impedance discontinuities are undesirable changes in characteristic impedance (Zo). Capacitance will usually decrease, and inductance will typically increase the Zo of a transmission line.
Inductance The larger the loop of current, the larger the inductance.
IR Drop IR drop is a voltage reduction that occurs when current flows through resistance of power rails. IR drop can cause major timing delays and should be minimized.
Jitter A jitter is a time variation of clock or data from a desired or average frequency. Jitter decreases window margin.
Line delay A line delay is the time delay a signal incurs while traveling from a driver to a receiver.
Lossy lines At high frequencies, a PCB trace exhibits dielectric and resistive loss. Dielectric loss will dominate.
Non-monotonic edges A non-monotonic edge is an edge that is not straight and can cause double clocking and/or errors. Edges of data and specially clocks should be monotonic.
Overshoot & undershoot Overshoot and undershoot is typically caused by reflection from impedance discontinuity. Undershoots are usually more dangerous.
Parasitics Parasitics include unwanted Zo discontinuity, additional capacitance, and inductance of connectors, packages, vias, and other components.
Power distribution It is important to be able to distribute power to all components with minimum voltage loss. Today’s Vdd voltages are getting lower and power consumption of IC’s is getting higher. Power distribution is becoming increasingly more difficult and needs careful consideration in design, since many SI problems can be traced to problematic power distribution systems.
RC delay The RC (resistance-capacitance) delay, such as that caused by the pins in IC packages, in combination with input capacitance of circuits directly on a silicon chip, must be taken into account in calculating the total time delay of a signal.
Reflections If a transmission line does not terminate in its characteristic impedance, energy will be reflected back to the driver.
Return current path Return current path is usually a ground. Current will return to the source through the lowest impedance, which implies through lowest inductance.
Ringing If the transmission line is not well terminated, electromagnetic energy will be reflected and re-reflected along the line.
Rise and fall time edge degradation Higher-frequency components of the edge are attenuated more than lower-frequency components. This will cause the edge to slow down and may result in inter-symbol interference.
Skin depth At high frequencies, current flows only in the outer skin of a conductor resulting in rising impedance of a transmission line and increased losses.
Stub length Stub length is the electrical length of an unterminated transmission line.
Termination A transmission line must be terminated into its Zo in order to prevent reflection of electromagnetic energy.
Transmission line If the propagation delay of a line from the driver to the receiver takes one-third or more time than the rise time of the signal, then the line must be considered a transmission line.
Vdd collapse Vdd collapse is usually caused by bypass capacitors and/or power distribution rails that do not have low enough impedance at a given frequency for the current demands of the ICs and terminating resistors. In reality, it is a bypass capacitor, especially the capacitance of power distribution planes that will supply instantaneous current needs. The power supply acts like a DC charger of this capacitance.
Technical Information
  • Signal Integrity
    Issues